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SVTPerformance's Chain of Restaurants
A Taste of Home
Mid-Atlantic Cobra Association
Computer Tech Needed
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<blockquote data-quote="Blk03SVTCobra" data-source="post: 3531354" data-attributes="member: 10866"><p>First of all, <a href="http://www.intel.com/technology/silicon/micron.htm" target="_blank">this link has the most information I've ever seen compiled in one place with regards to semiconductor technology and nanotechnology</a> and such.</p><p></p><p>Here's a brief summary (and others are obligated to correct me where applicable) of processes and the difference between 90nm and 65nm:</p><p></p><p>First of all, 90 nanometer (nm) process refers to the average feature size of a chip. In otherwords, a feature for that chip is, on average, 90nm. (NOTE: Minimum feature size on a 90nm process chip can be as low as ~45nm) The standard before the 90nm process was the 0.13 micrometer (130nm) process. The current, most-advanced, widely available process is the 65nm process (which has feature sizes as small as 35nm, but average is 65nm). For reference, the HIV virus is approximately 120nm in diameter, a human red blood cell is around 7000nm, and a human hair is typically around 80000nm.</p><p></p><p>The smaller the process, the more circuit 'real estate' (transistors per a given area) and increased speed (achieved due to smaller processor gates) there is. The more transistors per a given area, the more processing can occur in one time period. The smaller a processor gate, the quicker it can change between "ON" and "OFF", thus resulting in increased processing speed.</p><p></p><p>There are, of course, issues with continuing to make processes smaller. The largest of these is a problem called leakage. Leakage occurs when, due to the extremely small size of the walls between wires, electrons actually jump between wires on a chip. Leakage results in higher power consumption and heat output. To overcome leakage in 65nm process chips, a very thin layer of oxide is applied to the silicon wafer, which acts as insulating material to keep electrons inside of the chip's structures.</p><p></p><p>Check out those links or do a google search to learn more. It's pretty cool stuff if you take a couple of minutes to try to understand it. :beer:</p><p></p><p>Oh, and given the choices of chips you provided, I would choose the 651 Cedar Mill 2MB L2 Cache ($278.00). :thumbsup:</p></blockquote><p></p>
[QUOTE="Blk03SVTCobra, post: 3531354, member: 10866"] First of all, [URL=http://www.intel.com/technology/silicon/micron.htm]this link has the most information I've ever seen compiled in one place with regards to semiconductor technology and nanotechnology[/URL] and such. Here's a brief summary (and others are obligated to correct me where applicable) of processes and the difference between 90nm and 65nm: First of all, 90 nanometer (nm) process refers to the average feature size of a chip. In otherwords, a feature for that chip is, on average, 90nm. (NOTE: Minimum feature size on a 90nm process chip can be as low as ~45nm) The standard before the 90nm process was the 0.13 micrometer (130nm) process. The current, most-advanced, widely available process is the 65nm process (which has feature sizes as small as 35nm, but average is 65nm). For reference, the HIV virus is approximately 120nm in diameter, a human red blood cell is around 7000nm, and a human hair is typically around 80000nm. The smaller the process, the more circuit 'real estate' (transistors per a given area) and increased speed (achieved due to smaller processor gates) there is. The more transistors per a given area, the more processing can occur in one time period. The smaller a processor gate, the quicker it can change between "ON" and "OFF", thus resulting in increased processing speed. There are, of course, issues with continuing to make processes smaller. The largest of these is a problem called leakage. Leakage occurs when, due to the extremely small size of the walls between wires, electrons actually jump between wires on a chip. Leakage results in higher power consumption and heat output. To overcome leakage in 65nm process chips, a very thin layer of oxide is applied to the silicon wafer, which acts as insulating material to keep electrons inside of the chip's structures. Check out those links or do a google search to learn more. It's pretty cool stuff if you take a couple of minutes to try to understand it. :beer: Oh, and given the choices of chips you provided, I would choose the 651 Cedar Mill 2MB L2 Cache ($278.00). :thumbsup: [/QUOTE]
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